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Dynamic mechanical behavior during the thermosetting curing process
Author(s) -
Lewis Armand F.
Publication year - 1963
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760030308
Subject(s) - materials science , thermosetting polymer , epoxy , curing (chemistry) , composite material , dynamic mechanical analysis , amine gas treating , glass transition , activation energy , epoxide , modulus , flexural strength , flexural modulus , polymer , catalysis , organic chemistry , chemistry
The application of a free vibration technique to the study of the cross‐linking of an epoxy resin by an amine is demonstrated. Curing curves are presented showing the changes in dynamic mechanical flexural modulus and damping during reaction. At room temperature, the glass transition point is reached after a conversion of about 65% of the epoxide groups. Comparisons of the dynamic mechanical and infrared curing curves indicate a lowering of the reaction rate after this point is reached. Finally, an activation energy for the epoxy‐amine cross‐linking reaction is calculated.