Premium
Cryogenic adhesive properties of bisphenol‐A epoxy resins
Author(s) -
Hiza M. J.,
Barrick P. L.
Publication year - 1961
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760010207
Subject(s) - materials science , epoxy , adhesive , composite material , bisphenol a , ultimate tensile strength , epoxy adhesive , layer (electronics)
This article includes a comparison of the adhesive properties of bisphenol‐A expoxides at 300°K and 76°K with respect to the molecular weight of the uncured resins. Joints of 2024 aluminum were tested at 300°K and 76°K in tensile‐shear and in impact‐shear, and total linear thermal contraction of the cured resins was measured between the two temperatures. Results are discussed with respect to residual joint stresses and adsorptive properties of the resins.