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Hydroxy alkyl phosphate esters as curing agents for epoxy resins
Author(s) -
Cyr Marjorie C. St.
Publication year - 1961
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760010110
Subject(s) - epoxy , curing (chemistry) , bisphenol a , alkyl , materials science , adhesive , phosphate , epoxy adhesive , bisphenol , bisphenol s , alkali metal , softening point , composite material , organic chemistry , polymer chemistry , chemistry , layer (electronics)
A new curing system which yields room temperature curing epoxy adhesives with high bond strength and softening point has been developed for service in contact with high explosives. Bisphenol A type resins cured with hydroxyl alkyl phosphate acid esters are used. Short pot life and relatively low alkali resistance are drawbacks of the system.