A new reutilization strategy of waste printed circuit board nonmetal powders for constructing superhydrophobic coatings

Reutilization of waste printed circuit board nonmetal powders (WPCBP) has been one of the major bottlenecks in the comprehensive utilization of electronic wastes. Herein, a new reutilization strategy of WPCBP was innovatively proposed to develop a superhydrophobic coating. Typically, WPCBP@SiO 2 hybrid filler was successfully prepared by the in‐situ growth of silica on WPCBP surface, and the structures and compositions of WPCBP@SiO 2 were systematically investigated by SEM, FTIR, and TGA. Then the obtained WPCBP@SiO 2 was combined with polydimethylsiloxane (PDMS) to prepare a superhydrophobic coating. The as‐prepared PDMS/WPCBP@SiO 2 coatings exhibited excellent superhydrophobicity and self‐cleaning ability, whose static water contact angle (WCA) is more than 150° while the sliding angle (SA) is <10°. In summary, this study provides a green and efficient reutilization strategy of WPCBP in superhydrophobic coatings, which may open up a new opportunity for the high‐valued utilization of WPCBP.