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A new reutilization strategy of waste printed circuit board nonmetal powders for constructing superhydrophobic coatings
Author(s) -
Liu Wei,
Hu Dechao,
Liu Huaqing,
Ma Wenshi
Publication year - 2021
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.25747
Subject(s) - materials science , contact angle , polydimethylsiloxane , printed circuit board , coating , filler (materials) , superhydrophobic coating , nonmetal , composite material , nanotechnology , metallurgy , metal , computer science , operating system
Reutilization of waste printed circuit board nonmetal powders (WPCBP) has been one of the major bottlenecks in the comprehensive utilization of electronic wastes. Herein, a new reutilization strategy of WPCBP was innovatively proposed to develop a superhydrophobic coating. Typically, WPCBP@SiO 2 hybrid filler was successfully prepared by the in‐situ growth of silica on WPCBP surface, and the structures and compositions of WPCBP@SiO 2 were systematically investigated by SEM, FTIR, and TGA. Then the obtained WPCBP@SiO 2 was combined with polydimethylsiloxane (PDMS) to prepare a superhydrophobic coating. The as‐prepared PDMS/WPCBP@SiO 2 coatings exhibited excellent superhydrophobicity and self‐cleaning ability, whose static water contact angle (WCA) is more than 150° while the sliding angle (SA) is <10°. In summary, this study provides a green and efficient reutilization strategy of WPCBP in superhydrophobic coatings, which may open up a new opportunity for the high‐valued utilization of WPCBP.