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A model for modulus development of dual‐cure resin systems
Author(s) -
Redmann Alec,
Osswald Tim A.
Publication year - 2021
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.25628
Subject(s) - materials science , modulus , composite material , curing (chemistry) , softening , elastic modulus , dynamic mechanical analysis , thermal , phenomenological model , thermodynamics , polymer , physics , quantum mechanics
A phenomenological model for cure‐dependent modulus is described for materials undergoing a two‐stage curing reaction. These dual‐cure resin systems commonly use a thermally activated reaction in the second stage with temperatures exceeding the glass transition temperature of the intermediate product. This leads to a non‐linear development of the elastic modulus, with an observable softening effect and the potential for large structural deformations. In this study, the elastic modulus was measured at discrete levels of thermal conversion and processing temperatures. The results are used to determine the cure and temperature dependent‐modulus and create a model capable of following the modulus development throughout the entire thermal processing stage. Applications and a processing guideline are discussed.