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Modification of coconut fibers with polyaniline for manufacture of pressure‐sensitive devices
Author(s) -
Souza Junior Fernando Gomes,
Carlos Pinto José,
Alves Garcia Flávia,
Oliveira Geiza Esperandio,
Bruno Tavares Maria Inês,
Silva Andréa Maria,
Daher Pereira Emiliane
Publication year - 2014
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.23845
Subject(s) - polyaniline , materials science , ammonium persulfate , sonication , fourier transform infrared spectroscopy , dispersion (optics) , composite material , chemical engineering , polymer , polymerization , optics , physics , engineering
This article studies the modification of coconut fibers with polyaniline (PAni) with help of statistical experimental design techniques. The main factors studied here were the techniques used for particle dispersion (sonication vs . magnetic stirring) and the type of initiator (ammonium persulfate, APS, vs . ammonium cerium sulfate dihydrate, Ce(IV)). The obtained materials were characterized through low field nuclear magnetic resonance, small‐and wide‐angle X‐ray scattering, scanning electron microscopy, fourier transform infrared spectroscopy, and ultraviolet–visible spectroscopy. Additionally, the electrical resistivities and respective sensitivities to variations of the applied pressure were evaluated for all obtained samples, with help of standard volume resistivity measurements and electro‐mechanical tests. The materials prepared through magnetic stirring with APS presented the best electrical and electromechanical properties, although materials prepared through sonication with Ce(IV) also presented good electrical and electromechanical properties and could be prepared much faster. As a consequence, modification of coconut fibers with PAni, using sonication as the particle dispersion technique and Ce(IV) as initiator, constitutes a very promising procedure for manufacture of pressure‐sensitive devices. POLYM. ENG. SCI., 54:2887–2895, 2014. © 2014 Society of Plastics Engineers