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Polymer hybrid films based on silica and a poly(ether imide) containing phthalide groups
Author(s) -
Hamciuc Elena,
Hamciuc Corneliu,
Bacosca Irina,
Okrasa Lidia
Publication year - 2011
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.22005
Subject(s) - phthalide , materials science , glass transition , thermal decomposition , polymer , dielectric , ether , imide , polymer chemistry , polyimide , atmospheric temperature range , composite number , chemical engineering , composite material , organic chemistry , chemistry , physics , optoelectronics , layer (electronics) , meteorology , engineering
A study of thermal and electrical behavior of some silica‐containing poly(ether imide) films is presented. The hybrid films were prepared using a poly(amic acid) having phthalide groups and tetraethoxysilane via sol–gel technique and thermal cyclodehydration. Effects of inorganic particle content on polymer composite properties were investigated. Thermal and electrical characteristics of hybrid films were evaluated with respect to their structure. The films were flexible and showed good thermal properties having the initial decomposition temperature above 400°C and glass transition temperature in the range of 240–248°C. The dielectric spectroscopy revealed subglass transitions δ, γ, and β. At higher temperature, an α‐relaxation corresponding to the glass transition and the normal mode appeared. The dielectric constant values were in the range of 3.21–3.64 at 20°C and 10 kHz. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers