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Effect of nanoparticles on the performance of thermally conductive epoxy adhesives
Author(s) -
Fu Jifang,
Shi Liyi,
Zhang Dengsong,
Zhong Qingdong,
Chen Yi
Publication year - 2010
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.21705
Subject(s) - materials science , composite material , epoxy , adhesive , thermal conductivity , boron nitride , nanoparticle , electrical conductor , filler (materials) , surface modification , chemical engineering , nanotechnology , layer (electronics) , engineering
Microsized or nanosized α‐alumina (Al 2 O 3 ) and boron nitride (BN) were effectively treated by silanes or diisocyanate, and then filled into the epoxy to prepare thermally conductive adhesives. The effects of surface modification and particle size on the performance of thermally conductive epoxy adhesives were investigated. It was revealed that epoxy adhesives filled with nanosized particles performed higher thermal conductivity, electrical insulation, and mechanical strength than those filled with microsized ones. It was also indicated that surface modification of the particles was beneficial for improving thermal conductivity of the epoxy composites, which was due to the decrease of thermal contact resistance of the filler‐matrix through the improvement of the interface between filler and matrix by surface treatment. A synergic effect was found when epoxy adhesives were filled with combination of Al 2 O 3 nanoparticles and microsized BN platelets, that is, the thermal conductivity was higher than that of any sole particles filled epoxy composites at a constant loading content. The heat conductive mechanism was proposed that conductive networks easily formed among nano‐Al 2 O 3 particles and micro‐BN platelets and the thermal resistance decreased due to the contact between the nano‐Al 2 O 3 and BN, which resulted in improving the thermal conductivity. POLYM. ENG. SCI., 50:1809–1819, 2010. © 2010 Society of Plastics Engineers