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Effects of film and substrate dimensions on warpage of film insert molded parts
Author(s) -
Kim Seong Yun,
Lee Jung Tae,
Kim Jin Young,
Youn Jae Ryoun
Publication year - 2010
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.21649
Subject(s) - materials science , composite material , residual stress , mold , shrinkage , substrate (aquarium) , molding (decorative) , insert (composites) , layer (electronics) , geology , oceanography
Three‐dimensional flow and structural analyses were carried out for film insert injection molding to investigate warpage of film insert molded (FIM) parts with respect to variation of film and substrate thickness. Asymmetry of temperature distribution in the thickness direction was increased with increasing film thickness but decreased with increasing substrate thickness. Asymmetry of the in‐mold residual stress distribution in the FIM specimen was generated by the nonuniform temperature distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of the ejected FIM specimen was determined by relaxation of the asymmetric in‐mold residual stress distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of FIM specimens annealed at 80°C for 30 min showed complex behavior, and the behavior was understood by using factors such as degree of warpage of the ejected part, thermal shrinkage of the inserted film, and retardation of heat transfer. POLYM. ENG. SCI., 2010. © 2010 Society of Plastics Engineers