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Hot embossing of discrete microparts
Author(s) -
KuduvaRamanThanumoorthy Ramasubramani,
Yao Donggang
Publication year - 2009
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.21422
Subject(s) - embossing , materials science , mold , molding (decorative) , fabrication , composite material , thermoplastic , blow molding , natural rubber , medicine , alternative medicine , pathology
The hot embossing process has so far been developed mainly for replication of surface structures on thermoplastic substrates. Because of the lack of a through‐thickness action, fabrication of discrete microparts such as microgears is considered difficult. In this study, embossing molds having multiple microcavities were used in a through‐thickness embossing process with a rubber‐assisted ejection mechanism. Microparts made of HDPE and ABS with each part weighing approximately 1 and 1.4 mg, respectively, were produced. When in the mold, embossed microparts were intermittently connected to each other through thin residual films of a thickness approximately 20 μm. The residual films were detached from the microparts during a rubber‐assisted ejection stage. Because no resin delivery paths, e.g., runners and gates, are needed for microcavities on the multicavity embossing mold, this micropart fabrication process could replace micro injection molding in many applications. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers