Premium
Thermal properties of an epoxy cresol‐formaldehyde novolac/diaminodiphenyl sulfone system modified by bismaleimide containing tetramethylbiphenyl and aromatic ether structures
Author(s) -
Zhou Bo Xuan,
Huang Yi Jun,
Zhang Xing Hong,
Fu Zhi Sheng,
Qi Guo Rong
Publication year - 2009
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.21381
Subject(s) - materials science , differential scanning calorimetry , thermogravimetric analysis , sulfone , epoxy , monomer , thermal decomposition , glass transition , biphenyl , polymer chemistry , ether , formaldehyde , thermosetting polymer , polymer , nuclear chemistry , composite material , organic chemistry , chemistry , physics , thermodynamics
A bismaleimide monomer, 4,4′‐bis(4‐maleimidophenoxy)‐3,3′,5,5′‐tetramethyl biphenyl (BMITB), was synthesized in high yield (94%) via a facile four‐step reaction from 2,2′,6,6′‐tetramethyl‐4,4′‐biphenol. The chemical structure of BMITB was confirmed by FTIR, 1 H NMR, 13 C NMR and elemental analysis. The monomer used to modify the epoxy cresol‐formaldehyde novolac resin (ECN)/diaminodiphenyl sulfone (DDS) system. Cured ECN/BMITB/DDS blends with higher BMITB content had two distinct glass transition temperatures that were above 250°C according to differential scanning calorimetry, indicating that an interpenetrated polymer network structure may be formed. The initial thermal decomposition temperature and integral procedure decomposition temperature of the cured ECN/BMITB/DDS blends were >390 and 1080°C, respectively, according to thermogravimetric analyses. No phase separation was observed in dynamic mechanical analysis of cured ECN/BMITB/DDS blends with small amounts of BMITB (5 and 10 wt%). POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers