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The effect of copper(II) on the thermal and mechanical properties of poly(vinyl alcohol)/silica hybrid
Author(s) -
Li Juan,
Suo Jinping,
Wang Shifang
Publication year - 2009
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.21371
Subject(s) - vinyl alcohol , crystallinity , materials science , vinyl chloride , copper , thermal decomposition , ultimate tensile strength , decomposition , composite material , copper chloride , alcohol , polymer chemistry , chemical engineering , polymer , copolymer , metallurgy , organic chemistry , chemistry , engineering
A novel copper‐poly(vinyl alcohol) (PVA)/silica complex was prepared and its chemical structure, thermal, and mechanical properties were studied. The results showed that the crystallinity of PVA first increased and then decreased by the addition of copper chloride, whereas, the thermal decomposition temperature increased dramatically. For PVA/silica hybrid, the decomposition temperature associated with the removal of water molecules in PVA chains was 262°C. But the temperature increased to 361°C when the content of copper chloride was 2 wt%. The intelligent electronic tensile tester was used to investigate the mechanical properties of these complexes. The results suggested that the tensile strength of the complexes is improved with negligible decrease in the plasticity. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers

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