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Investigation of the relationships between die build up and die swell
Author(s) -
Hogan Todd A.,
Walia Parvinder,
Dems Bernard C.
Publication year - 2009
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.21275
Subject(s) - die swell , die (integrated circuit) , polyolefin , extrusion , materials science , swell , composite material , shear (geology) , capillary action , shear rate , natural rubber , elastomer , polymer , shear stress , polymer science , polymer chemistry , rheology , nanotechnology , oceanography , layer (electronics) , geology
Abstract Die build up (DBU) is a common problem encountered during extrusion of polymers where material accumulates around the die exit and may cause defects in the surface of the product. This study was initiated to better understand the fundamental relationships between DBU and die swell. The study was conducted on a strand die extrusion system using an ethylene‐octene polyolefin elastomer resin. This study demonstrated that die swell is not a root cause of DBU. It was shown that at constant shear rate, increasing the die L/D ratio results in an increase in DBU, while die swell decreases. The important variables influencing DBU for the resin used in this study were: the shear rate or shear stress in capillary portion of the die, the nominal residence time that the resin is exposed to the high shear stress in the die capillary, and the concentration of oligomers present in the resin or generated during processing. These data support the conclusion that DBU is due to the shear‐induced migration of oligomeric species in the polymer to the die surface. Higher shear rates and stresses in the die promote this migration and result in a higher concentration of oligomeric species near the die wall. POLYM. ENG. SCI., 2009. © 2008 Society of Plastics Engineers