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Enhancement of wood/polyethylene composites via compatibilization and incorporation of organoclay particles
Author(s) -
Zhong Yang,
Poloso Tony,
Hetzer Max,
De Kee Daniel
Publication year - 2007
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.20756
Subject(s) - materials science , organoclay , composite material , compounding , compatibilization , maleic anhydride , polyethylene , heat deflection temperature , high density polyethylene , wood flour , polymer , izod impact strength test , polymer blend , copolymer , ultimate tensile strength
Despite many advantages of wood–polyethylene composites, the shortcomings of this kind of composite include relatively low modulus, low notched impact resistance, relatively large thermal expansion, as well as substantial creep. In this article, in addition to using maleic anhydride grafted polyethylene as compatibilizer, organoclay was introduced into the polyethylene matrix so as to further enhance the thermal and mechanical performance. First, the influence of maleic anhydride grafted polyethylene type and loading on the morphology and properties of wood/HDPE composites was studied. Then, the effects of organoclay loading and of the compounding procedure on the wood/HDPE composites were investigated. The compatibilization was found to result in better polymer impregnation on the wood, reduced linear thermal expansion coefficients, and significantly improved mechanical properties. Incorporation of organoclay further reduced the thermal expansion and elevated the heat deflection temperature. More compatibilizer is needed to maintain the mechanical properties with the presence of clay. POLYM. ENG. SCI., 47:797–803, 2007. © 2007 Society of Plastics Engineers