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Calcium borate flame retardation system for epoxy molding compounds
Author(s) -
Ishii Toshiaki,
Kokaku Hiroyoshi,
Nagai Akira,
Nishita Takafumi,
Kakimoto Masaaki
Publication year - 2006
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.20424
Subject(s) - epoxy , materials science , flammability , fire retardant , composite material , curing (chemistry) , molding (decorative) , calcium , boron , calcium oxide , durability , oxide , calcium hydroxide , chemical engineering , organic chemistry , metallurgy , chemistry , engineering
A new flame retardation system for epoxy molding compounds was investigated for application to semiconductor packaging. By adding a small volume of calcium borate as a flame retardant, the flammability of the epoxy molding compound decreased. The flammability was not decreased proportionally with the volume of calcium borate. To further enhance flammability, an excess amount of phenolic resin was added to the epoxy molding compound. With the effects of calcium oxide and the excess phenolic resin, we developed an epoxy molding compound which has a flame‐retardant level sufficient to satisfy the V‐0 classification of the UL94 rating. We also found that calcium oxide in the calcium borate accelerates the curing reaction of epoxy compounds due to its absorption of water from the phenolic resin hardener. Calcium hydroxide formed from calcium oxide and water was also considered to contribute to the decrease in flammability by releasing water at high temperatures. The flame retardation mechanism of this developed epoxy compound is also discussed. Finally, the developed epoxy compound was proved to have suitable moldability, mechanical properties, and durability for use as semiconductor packaging. POLYM. ENG. SCI., 46:799–806, 2006. © 2006 Society of Plastics Engineers