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Epoxy nanocomposites: Analysis and kinetics of cure
Author(s) -
TonThat M.T.,
Ngo T.D.,
Ding P.,
Fang G.,
Cole K. C.,
Hoa S. V.
Publication year - 2004
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.20106
Subject(s) - epoxy , kinetics , differential scanning calorimetry , materials science , activation energy , nanocomposite , fourier transform infrared spectroscopy , glass transition , composite material , polymer chemistry , polymer , chemical engineering , chemistry , thermodynamics , physics , quantum mechanics , engineering
The effect of organo‐nanoclay (Nanomer I30E) on the cure mechanism and kinetics of epoxy nanocomposites based on Epon 828 and Epicure 3046 was studied by means of dynamic differential scanning calorimetry (DSC) at four heating rates (2.5, 5, 10, and 20°C·min −1 ) and by Fourier transform infrared (FT‐IR) spectroscopy. The DSC cure data for epoxy‐amine mixtures with and without nanoclay was modeled by means of different approaches; the Kissinger and isoconversional models were used to calculate the kinetics parameters while the Avrami model was utilized to compare the cure behavior of the two systems. The Nanomer I30E was shown to initiate rapid homopolymerization of the Epon 828 resin at temperatures above 180°C. For the epoxy‐amine mixtures, the presence of nanoclay had little effect on the cure kinetics in the early stages (i.e., at lower temperatures), and the apparent activation energy was around 60 kJ·mol −1 . However, in the later stages, the apparent activation energy increased significantly in the absence of nanoclay, but did not do so when it was present. The presence of nanoclay also lowered the final glass transition temperature by about 4°C. Polym. Eng. Sci. 44:1132–1141, 2004. © 2004 Society of Plastics Engineers.