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Investigation of composite materials selection and joint layout design to enhance EMI shielding of electronic equipment
Author(s) -
Mottahed Behzad D.,
Manoochehri Souran
Publication year - 1997
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.11709
Subject(s) - electromagnetic shielding , electromagnetic interference , emi , joint (building) , materials science , enclosure , interference (communication) , electromagnetic compatibility , electronic equipment , shields , mechanical engineering , composite material , computer science , electronic engineering , structural engineering , telecommunications , engineering , channel (broadcasting) , computer hardware
Electromagnetic shielding is a critical issue in the design of electronic equipment. This is mostly due to the high receptivity of electronic components to unwanted electromagnetic emission and interference. To reduce this interference, a study is initiated to determine the effect of material and joint types on the shielding effectiveness of an electronic enclosure. Eight different but progressively more complex joints are designed and investigated in this study. Filled polymers and metallized filled polymers are selected and compared with the all metallic structures. An analytical approach utilizing conformal mapping to calculate the shielding effectiveness of joints is attempted. An experimental apparatus is designed and manufactured to aid in finding the best possible joint configurations. Economic factors in selecting optimum joint layout are also studied. A cost index relating the effective length, design factors, and the total length of the part is developed. Results are presented for the best joint configuration and material with the highest shielding effectiveness.