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Cure kinetics and properties of epoxy/dicyanate blends
Author(s) -
Kim Dae Su,
Shin Ju Ho
Publication year - 2000
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.11272
Subject(s) - materials science , differential scanning calorimetry , thermogravimetric analysis , curing (chemistry) , glass transition , dynamic mechanical analysis , kinetics , epoxy , polymer blend , thermal decomposition , autocatalysis , composite material , isothermal process , stoichiometry , polymer chemistry , copolymer , polymer , chemical engineering , thermodynamics , chemistry , organic chemistry , physics , quantum mechanics , engineering
The cure behavior and properties of epoxy/dicyanate blends containing a stoichiometric amount of an amine curing agent for epoxilde groups were investigated as a function of blend composition. Differential scanning calorimetry (DSC) was used to investigate the dynamic and isothermal cure behavior of the blends. The cure rate of the blend increased with increasing dicyanate content. A second order autocatalytic reaction mechanism described the cure kinetics of the blends. The kinetic parameters were determined by fitting the dynamic DSC data to the model kinetic equation. The k 10 and E 1 values were mainly affected by the change of dicyanate content. The glass transition temperature of the blend decreased with increasing dicyanate content. The thermal decomposition characteristics of the blends were investigated by thermogravimetric analysis (TGA). Dynamic mechanical analysis (DMA) and thermal mechanical analysis (TMA) were used to investigate the mechanical properties of the blends. With increasing dicyanate content, the cure rate increased but the thermal and mechanical properties of the cured blends were not improved.