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Chemorheological analysis of an epoxy‐novolac molding compound
Author(s) -
Hsieh T. H.,
Wang T. L.,
Ho K. S.,
Wang Y. Z.
Publication year - 2000
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.11175
Subject(s) - activation energy , materials science , epoxy , differential scanning calorimetry , rheology , arrhenius equation , thermoplastic , kinetic energy , composite material , kinetics , viscosity , phenomenological model , molding (decorative) , thermodynamics , polymer chemistry , chemistry , mathematics , physics , statistics , quantum mechanics
The chemorheological behavior of an epoxy‐novolac molding compound was studied by a combination of differential scanning calorimetry and dynamic rheological measurements. Based on a modified version of Kamal and Sourour's kinetic expression, a procedure aiming at the phenomenological description of cure kinetics was developed. In combination with our kinetic study, an empirical Arrhenius‐type expression was adopted for the description of the dependence of complex viscosity on temperature, frequency, and conversion by allowing the pre‐exponential factor and the flow activation energy to be frequency‐ and conversion‐dependent. At low conversions (α < ∼0.05), the system behaves approximately as a thermoplastic material; at higher conversions, the rheological behavior of the system was dominated by the extent of cure reaction.