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Sequential injection molding of thermoplastic polymers. Analysis of processing parameters for optimal bonding conditions
Author(s) -
Carella A. R.,
Alonso C.,
Merino J. C.,
Pastor J. M.
Publication year - 2002
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.11107
Subject(s) - materials science , thermoplastic , mold , molding (decorative) , polymer , thermoplastic polymer , composite material , bonding strength
A systematic approach was used to study the effect of the process variables that control bonding of the injected melt to the previously injected parts, in sequential injection molding of thermoplastic polymers. Three polymer pairs were sequentially injected in a mold with the same geometry, in a range of mold and injected melt temperatures, and packing pressure conditions. Standard Peel Tests were conducted on injected samples to measure the resulting bonding strength. The analysis of the experimental results allows the quantification of the relative importance of the processing parameters involved. A direct correlation is found between the calculated interface temperature and the packing pressure needed for bonding. A generalized procedure is proposed to establish the processing conditions, which allow polymerpolymer bonding to be optimized.