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Modeling and simulation of thermally induced stress and warpage in injection molded thermoplastics
Author(s) -
Liu ShihJung
Publication year - 1996
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.10468
Subject(s) - materials science , molding (decorative) , residual stress , mold , composite material , finite element method , stress (linguistics) , overlay , polymer , mechanical engineering , structural engineering , computer science , engineering , linguistics , philosophy , programming language
Thermally induced stress and the relevant warpage caused by inappropriate mold design and processing conditions are problems that confound the overall success of injection molding. A visco‐elastic phase transformation model, using a standard linear solid for the solidified polymer and a viscous fluid model for the polymer melt, of 2‐D finite element scheme with 8 noded overlay isoparametric elements was used to simulate and predict the residual stress and warpage within injection molded articles as induced during the cooling stage of the injection molding cycle. Computed results are in good agreement with published experimental data. The approach proposed here is to examine and simulate the injection molding solidification process with the intent of understanding and resolving more inclusive and realistic problems.