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The fracture toughness of thin polymeric films
Author(s) -
Klemann Bruce M.,
DeVilbiss Tad
Publication year - 1996
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.10393
Subject(s) - materials science , composite material , fracture toughness , kapton , fracture (geology) , brittleness , residual stress , tensile testing , polystyrene , ductility (earth science) , stress (linguistics) , ultimate tensile strength , stress intensity factor , fracture mechanics , thin film , polyimide , polymer , creep , linguistics , philosophy , layer (electronics) , nanotechnology
A fracture test using the single edge notch (SEN) geometry was developed for thin polymeric films. The SEN specimens were videotaped while they were stressed to fracture within an Instron tensile testing machine operating at a constant crosshead speed. Critical stress intensity factors for fracture instability and for the initiation of crack growth, along with the corresponding fracture energies, were obtained using a residual stress analysis. The method is applicable to brittle films and films of moderate ductility. Critical stress intensity factors ranging from 0.12 to 4.03 MPa√m were determined for thin films under plane stress conditions. Results of the test are presented for poly(di‐n‐hexylsilane), Kapton polyimide, polystyrene, and Trycite biaxially oriented polystyrene film. Validation of the test and interpretation of the results are also discussed.