Tin‐Lead flake poly (ether sulfone) composite formed by in‐situ melt processing of tin‐lead particles | Zendy

Li Lin | Zendy; Chung D. D. L. | Zendy

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Tin‐Lead flake poly (ether sulfone) composite formed by in‐situ melt processing of tin‐lead particles

Author(s) -

Li Lin,

Chung D. D. L.

Publication year - 1993

Publication title -

polymer composites

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.577

H-Index - 82

eISSN - 1548-0569

pISSN - 0272-8397

DOI - 10.1002/pc.750140502

Subject(s) - flake , materials science , tin , composite material , composite number , hot pressing , electrical resistivity and conductivity , pressing , metallurgy , electrical engineering , engineering

Tin‐lead (60Sn‐40Pb) flake poly(ether sulfone) (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn‐Pb particles in a matrix of PES at a temperature above the melting temperature of Sn‐Pb and above the glass transition temperature of PES. Hot pressing at 240°C and 6.51 Mpa resulted in a 15 vol% Sn‐Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol% aluminum flakes that were not formed in‐situ. The electrical properties of the in‐situ PES/Sn‐Pb flake composites were much better than those of PES/Sn‐Pb flake composites were fabricated by hot pressing at 310°C (the manufacturer‐suggested fabrication temperature), though the mechanical properties were not as good.

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