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Thermal properties of nickel powder filled polypropylene composites
Author(s) -
Maiti S. N.,
Mahapatro P. K.
Publication year - 1990
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.750110405
Subject(s) - vicat softening point , materials science , composite material , thermogravimetric analysis , polypropylene , thermal stability , nickel , filler (materials) , softening point , metallurgy , chemical engineering , engineering
The thermal properties of nickel powder filled polypropylene composites were measured over a range of filler concentrations. The thermal conductivities increased with filler concentration. Data were compared with predictions by theoretical models for two phase systems. The equation of Cheng‐Vachon gave reasonable agreement with measurements. A TGA (thermogravimetric) study of the composites showed that the presence of nickel powder increases the thermal stability of polymer through an increase in activation energy to a maximum at a critical filler concentration, beyond which the stability decreased. The Vicat softening point of the composites was also increased in the presence of Ni powder.

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