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Composite lamination—analysis and modeling
Author(s) -
Appelt B. K.,
Gotro J. T.,
Schmitt G. P.,
Ellis E. T.,
Wiley J. P.
Publication year - 1986
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.750070205
Subject(s) - lamination , materials science , composite material , composite number , rheology , viscosity , dielectric , glass fiber , layer (electronics) , optoelectronics
Multilayer printed circuits are a prime example of complex polymer composites. One of the critical steps in manufacturing of the circuit boards is the lamination process, which is frequently simulated by the aborted flows test (AFT). In order to obtain a composite free of voids and good interlaminar adhesion, it is imperative for the resin to flow into metal interfaces as well as intermix in the resin interfaces. On an empirical basis, the AFT is used as a process monitor for making prepreg, the glass fiber reinforced dielectric which supports the circuitry. Under a given set of conditions (temperature profile, pressure, layup), AFT measures advancement and reactivity of prepreg. By using a given batch of prepreg, the optimum laminating conditions can be identified, which are mainly a function of the temperature profile. Here, a calorimetric and rheological study of prepreg cure kinetics during lamination is presented. The flow process is being modeled by calculating the viscosity from combining a temperature dependent viscosity term with a kinetically controlled molecular weight term.