Premium
Electrical resistivity behavior of solution‐cast metal‐filled composites
Author(s) -
Singh Rajeev R.,
Roberts Robert W.
Publication year - 1985
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.750060111
Subject(s) - materials science , composite material , electrical resistivity and conductivity , electrical conductor , percolation threshold , copper , metal , percolation (cognitive psychology) , volume (thermodynamics) , polymethyl methacrylate , aluminium , electrical resistance and conductance , polymer , metallurgy , physics , quantum mechanics , neuroscience , electrical engineering , biology , engineering
Solvent‐cast metal‐filled composites made of polymethyl methacrylate and aluminum or copper exhibited electrical resistance behavior as is predicted by the percolation and tunneling mechanisms. A precipitous change in volume resistivity of about 10 10 ohm‐cm was found to be thermally dependent at volume concentration of filler in the range from 17 to 19.5 percent. Materials with compositions at the conductive‐non‐conductive threshold showed semi‐conductor behavior and exhibited memory switching.