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Comprehensive promotion of mechanical properties of epoxy by electrical insulating filler of Si 3 N 4 whiskers at low content
Author(s) -
Zhang Dian,
Liu Jing,
Liu Xuan,
Liu Yijun,
Yang Xiaofeng,
Gao Yunqin,
Ma Aiqiong
Publication year - 2020
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.25726
Subject(s) - materials science , epoxy , composite material , whiskers , brittleness , composite number , filler (materials) , fracture toughness , modulus , dielectric , optoelectronics
The improvement of the mechanical properties of brittle epoxies by various fillers, especially by carbon‐related materials, has attracted significant attention and achieved impressive results. However, the dielectric properties of an epoxy may be compromised along with the improvement, and there is an urgent need to develop electrical insulating fillers to address this issue. In this study, Si 3 N 4 whiskers (Si 3 N 4w ) are first introduced as the filler used to prepare a composite of Si 3 N 4w /epoxy. The results indicate that Si 3 N 4w has an outstanding capability to comprehensively improve the mechanical properties of an epoxy. The maximal reinforcing and toughening effect could be obtained at a low filler content of 3.0%. The bending strength, Young's modulus, K IC and work of fracture of the composite can be augmented by 34.05%, 23.00%, 57.53%, and 513.50%, respectively, in comparison with those of the neat epoxy. The abundant energy dissipation mechanisms responsible for these effects are observed and interpreted. Finally, a brief phenomenological fracture process of Si 3 N 4w /epoxy is proposed.