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Thermal and electrical properties of phenol formaldehyde foams reinforcing with reduced graphene oxide
Author(s) -
Sandhya P K,
Sreekala M S,
Boudenne Abderrahim,
Garnier Bertrand,
Rouxel Didier,
Padmanabhan Moothetty,
Kalarikkal Nandakumar,
Thomas Sabu
Publication year - 2020
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.25715
Subject(s) - graphene , materials science , oxide , nanocomposite , composite material , filler (materials) , formaldehyde , thermal conductivity , phenol , dielectric , electrical resistivity and conductivity , chemical engineering , nanotechnology , chemistry , organic chemistry , optoelectronics , engineering , electrical engineering , metallurgy
In this study, phenol formaldehyde/reduced graphene oxide (PF/RGO) foam nanocomposites were prepared. Here, RGO was obtained by the reduction of graphene oxide using an eco‐friendly reducing agent potato starch. The scanning electron microscopic images of RGO reinforced foams exhibited smaller cells with thick cell walls as compared to neat PF foam that confirms the incorporation of filler material. The thermal and dielectric properties of the PF/RGO foams were improved with increasing the wt% of RGO. The incorporation of RGO improved the thermal conductivity of the PF matrix (11.3% for 0.15 wt% of RGO) to a small extent. The prepared foams are efficient thermal insulation materials as well as efficient electrical conductors.