Thermal, mechanical, and dielectric properties of aluminium oxide and solid glass microsphere‐reinforced epoxy composite for electronic packaging application

Substantial consideration is being devoted to the innovation, characterization, and execution of low density, corrosion resistant and low cost raw material and manufacturing of polymer based composite materials. Based on that, a series of novel flexible hybrid composites consisting of aluminium oxide (Al 2 O 3 ) and solid glass microspheres (SGMs) in an epoxy matrix for high performance microelectronic components are designed and fabricated. Their physical, mechanical, thermal, and dielectric properties are studied. The measured thermal conductivity values are compared with calculated values obtained from the already established mathematical model and are found to be in good agreement with experimental findings. Result indicates that compared with raw epoxy, effective thermal conductivity and dielectric constant increases with Al 2 O 3 content and decreases with SGM content. Meanwhile, glass transition temperature increases whereas coefficient of thermal expansion decreases with either of the filler content. Due to outstanding comprehensive properties, epoxy/Al 2 O 3 /SGM composites have a promising potential application in wide electronic packaging field. POLYM. COMPOS., 40:2573–2581, 2019. © 2019 Society of Plastics Engineers