Premium
Bond behavior of NiTiNb SMA wires embedded in CFRP composites
Author(s) -
ElTahan M.,
Dawood M.
Publication year - 2018
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.24408
Subject(s) - materials science , composite material , finite element method , digital image correlation , shape memory alloy , cohesion (chemistry) , nickel titanium , composite number , cohesive zone model , fracture mechanics , structural engineering , chemistry , organic chemistry , engineering
This article summarizes the details of an experimental and analytical program that was conducted to study the bond behavior between nickel‐titanium‐niobium shape memory alloy wires and fiber reinforced polymer composites. Understanding this bond behavior will facilitate the design of composite systems that are fabricated using both materials and which would exhibit unique properties that cannot be achieved using either material separately. A total of nine pull‐out specimens were fabricated and tested. A digital image correlation (DIC) noncontact measurement system was used to identify the onset and propagation of the debonding. The experimental results indicated that the interfacial bond transfer consists of two components: cohesion (before the onset of debonding) and friction (after the onset of debonding). A 3‐D nonlinear finite element analysis (FEA) was conducted to investigate the debonding mechanism of the pull‐out specimens. A trilinear cohesive zone model was used to model the interface taking into account the cohesive and friction components of the stress transfer at the interface. The debonding mechanism predicted by the FEA matches the experimental observations that were obtained using conventional instruments and the DIC system, well. POLYM. COMPOS., 39:3780–3791, 2018. © 2017 Society of Plastics Engineers