Premium
Preparation and characterization of synergistically improved thermally conductive polyamide 6 with low melting point metal and low‐temperature expandable graphite
Author(s) -
Jia Yunchao,
He Hui,
Yu Peng,
Chen Jian,
Tian Shenghui
Publication year - 2018
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.24132
Subject(s) - materials science , polyamide , differential scanning calorimetry , composite material , melting point , microstructure , graphite , composite number , ternary operation , temperature coefficient , physics , computer science , thermodynamics , programming language
The effects of introduction of low‐temperature expandable graphite (EG) and low melting point metal‐tin (Sn) on the thermal conductivity (TC) of polyamide 6 (PA6) were investigated. After introducing 10 wt% of Sn as single filler, the TC of PA6 was nearly constant, while this value was dramatically increased to 5.187 W (mk) −1 when 10 wt% of Sn was added into PA6/EG(40 wt%). The value was 90.1% higher than that of PA6/EG (40 wt%) composite, and 21.9% higher than that of PA6/EG (50 wt%), which suggested that the incorporation of EG and Sn had significant synergistic effect on the TC improvement of PA6. The electrical conductivity of the composite increased nearly 7 orders of magnitudes at the maximum filler content. Characterization of microstructure and energy spectrum analysis indicated that the dispersion of Sn in PA6/EG/Sn ternary composites was much more uniform than that of PA6/Sn binary composites. Differential scanning calorimetry measurement revealed that the crystalline peaks of Sn in PA6/EG/Sn composites disappeared and new exothermic peaks emerged at higher temperatures, which was mainly ascribed to the interaction between EG sheets and Sn. POLYM. COMPOS., 39:1818–1826, 2018. © 2016 Society of Plastics Engineers