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Room temperature preparation, electrical conductivity, and thermal behavior evaluation on silver nanoparticle embedded polyaniline tungstophosphate nanocomposite
Author(s) -
Khan Anish,
Asiri Abdullah M.,
Aslam Parwaz Khan Aftab,
Gupta Vikas
Publication year - 2016
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.23433
Subject(s) - polyaniline , materials science , nanocomposite , thermal stability , electrical resistivity and conductivity , scanning electron microscope , fourier transform infrared spectroscopy , conductivity , composite material , thermal conductivity , chemical engineering , analytical chemistry (journal) , polymer , chemistry , polymerization , organic chemistry , engineering , electrical engineering
An advanced nanocomposite, polyaniline tungstophosphate (PANI‐WP) cation exchanger, was synthesized by simple solution method and treated with silver nitrate resulting silver embedded PANI‐WP (PANI‐WP/Ag). Spectroscopic characterization of PANI‐WP/Ag was carried out by scanning electron microscopy, fourier transform infrared spectroscopy, UV‐Visible spectroscopy, and X‐ray diffraction. Electrical conductivity measurements and thermal effect on conductivity of PANI‐WP/Ag was studied after acid treatment. The dc electrical conductivity was found 3.06 × 10 −3 S cm −1 for HCl doped, measured by 4‐in line‐probe dc electrical conductivity measuring technique. Thermal conductivity is stable with all temperatures in isothermal studies showing excellent stability of PANI‐WP/Ag material. Hybrid showed better linear Arrhenius electric conducting response for semiconductors, stable upto 120°C. It was observed that conductivity is at the border of metallic and semiconductor region. POLYM. COMPOS., 37:2460–2466, 2016. © 2015 Society of Plastics Engineers