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Preparation, microstructure, mechanical, and thermal properties of in situ polymerized polyimide/organically modified sericite mica composites
Author(s) -
Zhang Qi,
Li Duxin,
Lai Dengwang,
You Yilan,
Ou Baoli
Publication year - 2016
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.23402
Subject(s) - materials science , organoclay , mica , composite material , sericite , polyimide , thermal stability , in situ polymerization , nanocomposite , montmorillonite , dynamic mechanical analysis , polymerization , microstructure , polymer , layer (electronics) , chemical engineering , quartz , engineering
In this work, sericite mica was initially modified with a multi‐step procedure and the novel composites of polyimide (PI) with the organophilic sericite mica were subsequently synthesized via in situ polymerization technique. XRD patterns revealed d 002 ‐spacing of clay was expanded from 0.99 to 2.77 nm. TEM photographs indicated majority of the organoclay exhibited an exfoliated morphology structure in composites with 5 wt% filler loading. Several critical properties of composites such as thermal stability, mechanical property, and storage modulus were tremendously enhanced with the increasing organoclay loading. Especially, the glass transition temperature of composites with 7 wt% organoclay addition revealed a 72°C increment compared with pristine PI, indicating greater improvement than the reported literature values. POLYM. COMPOS., 37:2243–2251, 2016. © 2015 Society of Plastics Engineers