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13 C CP/MAS NMR studies on the curing characteristics of phenol formaldehyde resin in the presence of nano cupric oxide and surfactants. II. Effect of CuO loading levels
Author(s) -
Gao Wei,
Du Guanben,
Kamdem Donatien Pascal
Publication year - 2016
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.23254
Subject(s) - materials science , formaldehyde , curing (chemistry) , pulmonary surfactant , phenol formaldehyde resin , phenol , adhesive , nano , oxide , methylene , chemical engineering , water resistance , composite material , microemulsion , nuclear chemistry , organic chemistry , chemistry , metallurgy , layer (electronics) , engineering
The effect of various loadings of nano cupric oxide (CuO) and surfactants in the formulation of phenol formaldehyde (PF) adhesive was investigated using solid 13 C CP/MAS NMR. Bonding strength and water resistance of plywood made with the modified adhesive were conducted. Solid NMR analysis showed that the addition of nano CuO alone or in combination with surfactant together was effective in improving the curing property of PF resin, which was confirmed by the NMR reveal that the amount of aliphatic carbons from methylene linkages increase with the addition of nano CuO in the PF resin. The addition of the mixture of alkane surfactant and nano CuO in the resin improved the water resistance property of the resulted plywood as well. POLYM. COMPOS., 37:949–954, 2016. © 2014 Society of Plastics Engineers