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Enhancing the thermal conductivities of SiO 2 /Epoxy composites by orientation
Author(s) -
Mu Qiwu,
Li Qiaomei,
Liu Hui
Publication year - 2016
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.23239
Subject(s) - epoxy , composite material , materials science , thermal conductivity , ultimate tensile strength , molding (decorative)
To improve the thermal conductivity of epoxy resin, tensile way was used to orient the molecular chain of epoxy resin with SiO 2 particles filled. In this article, SiO 2 /Epoxy composites which had approximately one‐dimensional lattice structure were prepared. The heat generated by LED chip rapidly passed along the direction of the one‐dimensional orientation in SiO 2 /Epoxy composites. The results showed that the thermal conductivity of oriented composites increased with the increase of silica concentration and draw ratio (If S is the cross‐sectional areas of composites at the mold outlet, S 0 is the cross‐sectional areas of composites after molding set, and draw ratio is S / S 0 ). With the addition of 50 wt% SiO 2 to the epoxy resin, the thermal conductivity of oriented SiO 2 /Epoxy composites with the draw ratio of 4 was 0.873 W/m K, which was 2.55 times that of unoriented SiO 2 /Epoxy composites. And a thermal conductivity, 5.97 times that of the epoxy resin, was obtained with 80 wt% SiO 2 and the draw ratio of 4. Nevertheless, the relative permittivities of epoxy composites which had 50 wt% SiO 2 with the draw ratio of 4 are stable with increasing frequency. POLYM. COMPOS., 37:818–823, 2016. © 2014 Society of Plastics Engineers