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Preparation and properties of organoclay/polyethersulphone/epoxy hybrid nanocomposites
Author(s) -
Wang Yang,
Ma Xia,
Zhang Boming
Publication year - 2015
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.22998
Subject(s) - organoclay , materials science , epoxy , nanocomposite , composite material , compounding , fracture toughness , toughness , microstructure , composite number , ultimate tensile strength
High performance organoclay/polyethersulphone/epoxy hybrid nanocomposites were successfully prepared by solvent method and melting method, respectively. Preparation methods, microstructures, and properties of these hybrid nanocomposites were studied. Since melting method was easy to attain, environmental‐friendly, and able to produce the hybrid nanocomposites with better properties, it proved to be a preferential preparation method. Although the viscosity of the reaction mixture was relatively high in this method, improving temperature to some extent solved this problem. For the study on the microstructures of the hybrid nanocomposites, they are comprised of polyethersulphone/epoxy semi‐interpenetrating network matrices and orderly exfoliated organoclay. The hybrid nanocomposites had good thermal performance, high tensile properties and high fracture toughness. Synergistic toughening effect of polyethersulphone and organoclay on epoxy resin was observed. POLYM. COMPOS., 36:767–774, 2015. © 2014 Society of Plastics Engineers