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Fabrication of polyimide composite films based on carbon black for high‐temperature resistance
Author(s) -
Kwon Jinuk,
Kim Jinyoung,
Lee Jeeeun,
Han Patrick,
Park Dongmyung,
Han Haksoo
Publication year - 2014
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.22886
Subject(s) - carbon black , polyimide , materials science , differential scanning calorimetry , glass transition , composite number , thermal decomposition , composite material , pi , fabrication , carbon fibers , thermal , polymer chemistry , polymer , organic chemistry , layer (electronics) , chemistry , thermodynamics , medicine , biochemistry , natural rubber , physics , alternative medicine , pathology
A novel high‐performance material, carbon black (CB) polyimide (PI), was obtained by the chemical synthesis of CB (carbon black N326) with PI. Following its synthesis, several analyses were carried out to investigate the thermal and mechanical properties of the newly synthesized CB‐PI. The thermal decomposition temperature of CB‐PI compared to PI increased by 76°C from 508 to 584°C. The glass transition temperature of CB‐PI as evaluated by differential scanning calorimetry increased by 204°C from 379 to 583°C compared to that of PI. Moreover, the mechanical strength of CB‐PI increased by 16% compared to that of PI. In addition, the analyses confirm that CB and PI in the synthesized CB‐PI were chemically crosslinked, which was shown to be responsible for the superior thermal and mechanical properties of the CB‐PI. POLYM. COMPOS., 35:2214–2220, 2014. © 2014 Society of Plastics Engineers