Preparation and properties of silicon nitride/glass fiber/epoxy composites | Zendy

Zhang Jian | Zendy; Qi Shuhua | Zendy

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Preparation and properties of silicon nitride/glass fiber/epoxy composites

Author(s) -

Zhang Jian,

Qi Shuhua

Publication year - 2014

Publication title -

polymer composites

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.577

H-Index - 82

eISSN - 1548-0569

pISSN - 0272-8397

DOI - 10.1002/pc.22785

Subject(s) - epoxy , materials science , composite material , flexural strength , silicon nitride , dielectric , glass fiber , thermal conductivity , composite number , filler (materials) , thermal , nitride , physics , optoelectronics , layer (electronics) , meteorology

Silicon nitride/glass fiber (Si 3 N 4 /GF) hybrid fillers are performed to prepare the Si 3 N 4 /GF/epoxy composites. Results showed the thermal conductivities of the Si 3 N 4 /GF/epoxy composites that are improved with the addition of Si 3 N 4 , and the thermal conductive coefficient λ is 1.412 W/mK with 38 vol% modified Si 3 N 4 /GF hybrid fillers (30 vol% Si 3 N 4 + 8 vol% GF), seven times higher than that of pure epoxy resin. The flexural strength and impact strength of the composites are optimal with 13 vol% modified Si 3 N 4 /GF hybrid fillers (5 vol% Si 3 N 4 + 8 vol% GF). The dielectric constant and dielectric loss of the composites are increased with the increasing addition of Si 3 N 4 . For a given Si 3 N 4 /GF hybrid fillers loading, the surface modification can further improve the thermal conductivities of the Si 3 N 4 /GF/epoxy composites. POLYM. COMPOS., 35:1338–1342, 2014. © 2013 Society of Plastics Engineers

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