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Preparation and properties of polyhedral oligomeric silsesquioxane/epoxy hybrid resins
Author(s) -
Ding Guojun,
Fu Jifang,
Dong Xing,
Chen Liya,
Jia Haisen,
Wenqi Yu,
Shi Liyi
Publication year - 2013
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.22579
Subject(s) - silsesquioxane , epoxy , materials science , thermal stability , glass transition , char , composite material , electrical resistivity and conductivity , thermal decomposition , absorption of water , polymer chemistry , chemical engineering , polymer , pyrolysis , organic chemistry , chemistry , electrical engineering , engineering
Octaaminophenyl polyhedral oligomeric silsesquioxane (OAPS) was synthesized using three‐step method and used to modify o ‐cresol‐novolac epoxy resin (ECN) for printed circuit board. The influence of OAPS on the reactivity and the final properties of the hybrid networks were evaluated. The intercrosslinking reaction between ECN and OAPS was confirmed by Fourier transform infrared spectra. The ECN/OAPS hybrids have better impact strength, higher electrical resistivity and thermal stability, lower water absorption than the unmodified ECN. The volume resistivity and surface resistivity of the hybrids increase by an order of magnitude or more compared to the neat epoxy. The thermal stability of the hybrids improves by the incorporation of OAPS; the initial decomposition temperature and char yield show an increasing tendency up to 4 wt% loading of OAPS. The hybrids exhibit higher storage modulus and glass transition temperature ( T g ) than the neat epoxy. The T g of the hybrids greatly improves up to 153.3°C at 3 wt% content, much higher than 119.4°C of the neat epoxy. POLYM. COMPOS., 34:1753–1760, 2013. © 2013 Society of Plastics Engineers