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Thermal, dielectric, and rheological properties of aluminum nitride/liquid crystalline copoly(ester amide) composite for the application of thermal interface materials
Author(s) -
Sinh Le Hoang,
Hong JeongMi,
Son Bui Thanh,
Trung Nguyen Ngoc,
Bae JinYoung
Publication year - 2012
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.22355
Subject(s) - materials science , composite material , dielectric , composite number , dispersant , nitride , scanning electron microscope , aluminium , rheology , thermal conductivity , dielectric loss , layer (electronics) , dispersion (optics) , physics , optoelectronics , optics
In this article, thermally conductive and relatively low dielectric constant polymer matrix composites of an aluminum nitride filler (AlN) and a novel liquid crystalline copoly(ester amide) (LCP) were prepared via a solution blending method in the presence of a phosphate containing dispersant. The viscosities, thermal conductivities, and dielectric properties of the prepared AlN/LCP composites were investigated as a function of AlN loading. Our experimental results demonstrated that the AIN/LCP composite with AlN concentration of 50 wt% had 2.5 times higher thermal conductivity than pure LCP (2.020 and 0.817 W/mK for composite with 50 wt% of AlN and pure LCP, respectively), but its dielectric constant remained at low level, i.e., < 9.0 at frequency of 900 Hz. In addition, viscosities of AlN/LCP pastes in the N ‐methyl‐2‐pyrrolidinone solvent remained at acceptable levels with the high AlN loading of 50 wt%. The morphologies of the prepared composites were also investigated by scanning electron microscopy. POLYM. COMPOS., 2012. © 2012 Society of Plastics Engineers