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Octa(aminophenyl) polyhedral oligomeric silsesquioxane/boron‐containing phenol–formaldehyde resin nanocomposites: Synthesis, cured, and thermal properties
Author(s) -
Gao Jungang,
Li Xing,
Wu Weihong,
Lin Haojie
Publication year - 2011
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.21105
Subject(s) - silsesquioxane , nanocomposite , materials science , formaldehyde , degradation (telecommunications) , phenol , phenol formaldehyde resin , activation energy , boron , composite material , chemical engineering , polymer chemistry , polymer , organic chemistry , chemistry , telecommunications , computer science , engineering
Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP‐POSS) and boron‐containing phenol‐formaldehyde resin (BPFR) were synthesized, respectively. The BPFR nanocomposites with different OAP‐POSS content (wt%) were prepared, and their properties were characterized. The results show that the thermal degradation process of this nanocomposites can be divided into three stages, and they are all following the first order mechanism. The residual ratio and thermal degradation activation energy E a of 9 wt% OAP‐POSS/BPFR nanocomposites are both better than others and the E a increase gradually in three stages, which is 93.3, 134.0, and 181.9 kJ mol −1 , respectively. Its residual ratio at 900°C is 36.48%. The mechanical loss peak temperature T p is 228°C for 12 wt% OAP‐POSSS/BPFR nanocomposites, which is higher 48°C than pure BPFR. POLYM. COMPOS., 2011. © 2011 Society of Plastics Engineers