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Effects of TEOS contents on swelling behaviors and mechanical properties of thermosensitive hybrid gels
Author(s) -
Huang WeiJen,
Lee WenFu
Publication year - 2010
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.20871
Subject(s) - swelling , materials science , interpenetrating polymer network , chemical engineering , self healing hydrogels , methacrylate , polymerization , polymer chemistry , morphology (biology) , network structure , composite material , polymer , engineering , machine learning , biology , computer science , genetics
A series of organic‐inorganic hybrid thermosensitive gels with three different structures and different contents of tetraethoxysilane (TEOS) were prepared from N ‐isopropylacrylamide (NIPAAm), and N,N′ ‐methylene‐bis‐acrylamide (NMBA) and TEOS [N‐IPN]; NIPAAm, 3‐(trimethoxysilyl) propyl methacrylate (TMSPMA) as coupling agent and TEOS [NT‐IPN]; and NIPAAm, TMSPMA and TEOS [NT‐semi‐IPN] by emulsion polymerization and sol‐gel reaction in this study. The effect of TEOS content on the swelling behavior, mechanical properties, and morphologies of the present gels was investigated. Results showed that the properties of the gels would be affected by the gel networks such as IPN or semi‐IPN, existence of TMSPMA as the bridge chain between networks, and content of TEOS. The NT‐semi‐IPN gel had higher swelling ratio because poly (NIPAAm) moiety in the semi‐IPN gels was not restricted by NMBA network. However, the IPN gels such as N‐IPN and NT‐IPN had good mechanical properties and lower swelling ratio, but had bad thermosensitivity due to the addition of coupling agent, TMSPMA, into the gel system that resulted in denser link between organic and inorganic components. Increasing TEOS content would also reduce the thermosensitivity of the hybrid gels. The morphology showed that IPN gels had partial aggregation (siloxane domain) and showed some denser phases. POLYM. COMPOS., 2010. © 2009 Society of Plastics Engineers