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Epoxy resin/exfoliated clay hybrid materials with high thermal properties
Author(s) -
Fu Tiezhu,
Yu Lianxiang,
Wang Zhe,
Yu Wenzhi,
Zhao Chengji,
Zhong Shuangling,
Cui Jiwen,
Shao Ke,
Na Hui
Publication year - 2009
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.20639
Subject(s) - epoxy , materials science , thermogravimetric analysis , composite material , dynamic mechanical analysis , curing (chemistry) , glass transition , exfoliation joint , polymer , chemical engineering , graphene , engineering , nanotechnology
A new type of organophilic clay grafted with the protonated 4, 4′‐methylenediamine was prepared. The epoxy was modified using the organophilic clay and was prepared by “acetone‐clay slurry” method. The morphology of the clay platelets into epoxy matrix were characterized by wide angle X‐ray diffraction and transmission electron microscopy. The results indicated that the epoxy resin/exfoliated clay hybrid materials were successfully prepared and the exfoliation of clay into epoxy matrix occurred in the curing process. The excellent thermal mechanical properties of the hybrid materials with the values of the storage modulus and glass transition temperature ( T g ) of the hybrid materials were studied by dynamic mechanical analysis. When 7 wt% of modified clay was added into epoxy, the storage modulus of hybrid materials increased to 1131 MPa at 110°C, and 51 MPa at 220°C in comparison to the pristine cured epoxy (661 MPa at 110°C and 6 MPa at 220°C). The high thermal stabilities of the hybrid materials especially in high temperature were also been researched by thermogravimetric analysis. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers