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Polyaniline–organoclay nanocomposites as curing agent for epoxy: Preparation and characterization
Author(s) -
Ayad M.M.,
Salahuddin N.,
Ali M.
Publication year - 2009
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.20599
Subject(s) - organoclay , materials science , nanocomposite , curing (chemistry) , polyaniline , epoxy , differential scanning calorimetry , composite material , scanning electron microscope , polymerization , in situ polymerization , polymer chemistry , chemical engineering , polymer , physics , engineering , thermodynamics
Abstract Polyaniline (PANI)–organoclay/Epoxy (EP) nanocomposites were prepared. PANI–organoclay nanocomposites were used as curing agent for EP. Organoclay was prepared by an ion exchange process between sodium cations in MMT and NH 3 + groups in polyoxypropylene (D 230 ). PANI–organoclay nanocomposite was synthesized by in situ polymerization of aniline in (14 wt%) organoclay. Infrared spectra and differential scanning calorimetry confirm the curing of EP. The absence of d 001 diffraction band of organoclay in the nanocomposites was observed by X‐ray diffraction. The structure argument was further supported by scanning electron microscopy and transmission electron microscopy. Electrical conductivity of the nanocomposites within the range 2.1 × 10 −7 –3.2 × 10 −7 S/cm depending on the concentration of the PANI/D 230 ‐MMT. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers