Mechanical and thermal properties of the hybrid composites of vinylester resin and methacryl‐substituted polysilsesquioxane | Zendy

Takahashi Tsutomu | Zendy; Katoh Takeshi | Zendy; Sakuma Takenori | Zendy; Someya Yoshihiro | Zendy; Shibata Mitsuhiro | Zendy

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Mechanical and thermal properties of the hybrid composites of vinylester resin and methacryl‐substituted polysilsesquioxane

Author(s) -

Takahashi Tsutomu,

Katoh Takeshi,

Sakuma Takenori,

Someya Yoshihiro,

Shibata Mitsuhiro

Publication year - 2009

Publication title -

polymer composites

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.577

H-Index - 82

eISSN - 1548-0569

pISSN - 0272-8397

DOI - 10.1002/pc.20592

Subject(s) - materials science , composite material , tetramethylammonium hydroxide , glass transition , methacrylate , composite number , dynamic mechanical analysis , epoxy , polymer , copolymer , nanotechnology

Vinylester resin (VER) composed of bisphenol‐A‐based epoxy methacrylate and styrene was cured finally at 120°C with methacryl‐substituted polysilsesquioxane (ME‐PSQ) prepared from 3‐(trimethoxysilyl)propyl methacrylate and tetramethylammonium hydroxide. The dynamic mechanical and thermal properties of the VER/ME‐PSQ 90/10–60/40 hybrid composites were investigated when compared with crosslinked‐VER (C‐VER) and VER/phenyl‐substituted polysilsesquioxane (Ph‐PSQ) 80/20 composite cured at the same condition. As a result, the VER/ME‐PSQ hybrid composites showed much higher storage modulus ( E ′) at rubbery state than C‐VER and the VER/Ph‐PSQ composite. The E ′ of the hybrid composites increased with increasing ME‐PSQ content. Also, coefficient of thermal expansion of the hybrid composites decreased with increasing ME‐PSQ content. The glass transition temperatures and 5% weight loss temperatures of the VER/ME‐PSQ hybrid composites were almost the same as those of C‐VER and the VER/Ph‐PSQ composite. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers

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