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Dielectric and conduction properties of polyimide/silica nano‐hybrid films
Author(s) -
Zhang MingYan,
Zeng ShuJin,
Fan Yong,
Zhang PeiHong,
Lei QingQuan
Publication year - 2008
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.20414
Subject(s) - polyimide , pyromellitic dianhydride , materials science , dielectric , composite material , nano , dispersion (optics) , layer (electronics) , optoelectronics , optics , physics
Dielectric and conduction properties of polyimide/silica nano‐hybrid films were investigated with the silica content and the testing frequency, using a small electrode system. The hybrid films were prepared through sol‐gel process and thermal imidization, by using pyromellitic dianhydride and 4,4′‐oxydianiline as polyimide precursors, and tetraethoxysilane and methyltriethoxysilane as silica precursors. The dielectric coefficient of PI/SiO 2 films was monotonically increased with increasing silica content, and decreased with increasing testing frequency. The dielectric loss of PI/SiO 2 films had no obvious changes with increasing silica content, but monotonically increased with increasing testing frequency. These can be contributed to the different quantity and migration chunnels of current carriers, which were mainly influenced by a few of complicated factors. There were remarkable differences between conduction property of PI/TEOS‐SiO 2 films and PI/MTEOS‐SiO 2 films because of the different size and dispersion status of silica particles in the polyimide matrix. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers