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Organic–inorganic hybrid boron‐containing phenol–formaldehyde resin/SiO 2 nanocomposites
Author(s) -
Gao Jungang,
Jiang Chaojie,
Ma Weitao
Publication year - 2008
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.20364
Subject(s) - materials science , thermogravimetry , thermal stability , nanocomposite , phenol formaldehyde resin , glass transition , fourier transform infrared spectroscopy , boron , thermogravimetric analysis , phenol , composite material , formaldehyde , epoxy , silicon , chemical engineering , polymer , organic chemistry , chemistry , engineering , metallurgy
The organic–inorganic hybrid boron‐containing phenol–formaldehyde (BPFR) resin/SiO 2 nanocomposites was synthesized in‐situ from boric acid, phenol, and tetramethoxysilane. The structure of BPFR modified and the distributions of silicon element were studied by Fourier‐transform infrared spectroscopy, energy dispersive X‐ray spectrometry, and transmission electron microscope, respectively. The glass transition temperature ( T g ) was determined by torsional braid analysis. The results show that silicon element distribution is homogeneous, and the size of nanosilica is about 40–60 nm. The thermal stability and kinetics parameters of thermal degradation were determined by thermogravimetry analysis (TGA). TGA results show that the resin modified has higher heat resistance property when the additive quantity of SiO 2 was 3 wt%. The temperature of 5% weight loss is 487.7°C, which is 12.4°C higher than that of common BPFR. The residual ratio of 3 wt% SiO 2 /BPFR was 62.3% at the temperature of 900°C, which is 11.2% higher than that of common BPFR. The mechanics loss peak T p of 3% SiO 2 /BPFR is 33°C higher than common BPFR. Fiberglass‐reinforced BPFR modified by 3 wt% SiO 2 has better mechanical and dielectric properties than that of common BPFR. POLYM. COMPOS., 2008. © 2007 Society of Plastics Engineers