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Influence of heat transfer and curing on the quality of pultruded composites. II: Modeling and simulation
Author(s) -
Ding Zhongman,
Li Shoujie,
Lee L. James
Publication year - 2002
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.10493
Subject(s) - pultrusion , materials science , heat transfer , die (integrated circuit) , composite material , composite number , computer simulation , thermal , mechanical engineering , mechanics , computer science , simulation , engineering , thermodynamics , nanotechnology , physics
In this study, a computer simulation code is developed to predict the dynamics of heat transfer in the pultrusion process. The die block and heater arrangement are included in the heat transfer analysis so that the simulation can provide the temperature profile at the interface between the die and the composite. The measured interface temperature profiles are then used to validate the simulation code. Energy management, i.e. heater power control along the heating die, is also considered in the simulation code. The code is capable of carrying out transient thermal analysis for both start‐up and steady‐state operation of the pultrusion process. From the experimental observations on the part quality in terms of blister formation, a processing window was obtained by showing the relation of the die length and the line speed to the part quality. The processing window is then generated numerically using the computer code based on the definition of a critical die length proposed in this work, and the result shows good agreement with the experimental data.