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Experimental characterization of autoclave‐cured glass‐epoxy composite laminates: Cure cycle effects upon thickness, void content, and related phenomena
Author(s) -
Thomas Matthew M.,
Joseph Babu,
Kardos John L.
Publication year - 1997
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.10282
Subject(s) - materials science , void (composites) , curing (chemistry) , composite material , epoxy , composite number , autoclave , composite laminates , metallurgy
This article presents results from over 100 experimental autoclave curing fiber‐glass‐epoxy composite laminate curing runs. The primary objective was to verify shrinking horizon model predictive control—SHMPC—for thickness and void content control, using readily available secondary measurements. The secondary objective was to present and analyze the extensive experimental results obtained through this verification. Seven series of curing runs (16 per series) were performed, with cure settings governed by partial‐ or full‐factorial orthogonal array based design of experiments. Through t‐tests and two‐way analysis of variance, it was found that pressure magnitude had the largest influence on laminate thickness and void content, while first hold duration/temperature, pressure application duration, and run delay influenced void content more than thickness. Thinner laminates with lesser void contents resulted from pressure application before the second temperature ramp. Prepreg age also affected thickness and void content. Photomicrographs revealed not one large void, but void clusters. Interrupted autoclave cure cycles revealed that significant laminate thickness reduction occurred during all curing cycle stages. The percentage of resin weight loss through laminate sides increased with pressure magnitude and application duration. Ten test curing runs indicated that SHMPC met difficult thickness targets while minimizing void content.