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The gradient of mechanical characteristics across the thickness of composite laminates after exposure to a low earth orbit environment
Author(s) -
Startsev Oleg V.,
Isupov V. V.,
Nikishin E. F.
Publication year - 1998
Publication title -
polymer composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.577
H-Index - 82
eISSN - 1548-0569
pISSN - 0272-8397
DOI - 10.1002/pc.10076
Subject(s) - materials science , composite material , epoxy , composite number , composite laminates , thermal expansion , temperature cycling , glass fiber , spacecraft , modulus , thermal , indentation hardness , dynamic mechanical analysis , temperature gradient , polymer , microstructure , physics , meteorology , engineering , aerospace engineering , quantum mechanics
This paper deals with a complex investigation of carbon and glass fiber reinforced plastics (CFRP, GFRP) and hybrid composites based on epoxy compositions and used in Salyut‐type spacecraft that had spent up to 1501 days in outer space. The samples with an unprotected surface and the samples exposed to outer space under the different screens have been explored. In the paper, results on thin measurements of dynamic shear modulus, Young's modulus, linear thermal expansion coefficient, glass transition temperature, and microhardness of the carbon plastics KMU‐31, KMU‐41, and glass plastics VPS‐7V are presented. Results show that thermal cycling of composite laminates in space, with a temperature difference of 200 K between the sunlit side and the reverse side, generates the gradient of mechanical properties across the plate thickness. Particular attention is given to the problem of thin layer measurement methodology and to the working out of experimental results. There are requirements for ground simulation research of composite laminates providing the same character of thermal cycling as in a low earth orbit, LEO. Some criteria are suggested for test equivalence, according to the data of dynamic mechanical analysis (DMA), linear dilatometry (LD), and microhardness.